AI computing and high-density GPU racks push power density sharply upward, making thermal management one of the core bottlenecks of modern data centers. Tonhe delivers integrated cooling & thermal management solutions paired with its HVDC power conversion hardware for general data centers and high-power intelligent computing centers, covering air cooling, module-level immersion liquid cooling, hybrid cooling and intelligent thermal control systems. The solution targets reducing PUE, improving power module reliability, supporting high rack power density and meeting green data center certification requirements, with full test data and field operation indicators as technical support.
1. Background & Pain Points
Traditional air cooling is increasingly constrained when rack power rises above 15kW/rack: high fan power consumption, hot-spot risks, limited temperature tolerance in high-altitude or harsh environments, and low energy efficiency. For 800V HVDC high-density power architectures for AI clusters, the rectifier modules generate concentrated heat. Poor cooling leads to module derating, reduced service life and higher OPEX.
Industry benchmark: Legacy air-cooled data centers often reach PUE 1.4~1.5; high-density AI racks may suffer local temperature overshoot >10°C without targeted thermal design.
Tonhe’s positioning: Co-design power electronics and cooling, instead of separate power and cooling systems, to optimize the whole chain energy consumption.
2. Tonhe Core Cooling & Thermal Management Solutions
2.1 High-efficiency Air Cooling Solution for HVDC Power Cabinets
Suitable for medium and low-density IDC, colocation and 240V/336V HVDC systems.
Architecture: Front-to-back airflow, hot/cold aisle isolation, built-in intelligent fan array inside rectifier modules; modular HVDC cabinet with 30kW per module, up to 24 modules per cabinet, max cabinet capacity 720kW.
Data Support:
- Module peak efficiency reaches 97%; intelligent fan speed adjustment linked to module junction temperature, reducing fan power consumption by 28% under partial load.
- Cabinet internal temperature difference controlled ≤5℃; supports continuous operation at 40℃ inlet air without power derating.
- Compliance: YD/T2378, YD/T3089, GB/T38833, with TLC certification.
2.2 Module-level Single Immersion Liquid Cooling Solution
Tonhe’s proprietary sealed single-module immersion liquid cooling, originally developed for high-power power electronic modules, is adapted for data center 800V HVDC rectifiers. Insulated dielectric coolant directly contacts power semiconductors, capacitors and magnetic components at device level, removing hot spots fundamentally.
Data Support:
- No built-in fans, 0dB noise at module level; IP67 sealed design, no dust accumulation risk.
- Module weighted efficiency ≥97.2%; meets Class 1 energy efficiency, standby zero-power consumption design.
- Enables non-derating operation at high altitude; eliminates air-density limitation of conventional air cooling.
- Measured temperature uniformity: component temperature spread within 4℃, compared with air cooling hotspot temperature difference >12℃.
- System-level thermal management energy consumption reduced by 43.8% vs conventional air-cooled cluster schemes in similar power scale.
- Difference from rack immersion cooling: Tonhe’s solution cools each HVDC power module independently. It avoids submerging servers, so customers can upgrade power side cooling without replacing IT racks.
2.3 Hybrid Free Cooling + AI Thermal Control Platform
Combine natural cold source (free cooling) with module liquid/air cooling, supported by unified monitoring platform.
Real-time collection: module junction temperature, cabinet inlet/outlet temperature, coolant flow, pressure, fan power, HVDC load rate.
AI predictive control: dynamic setpoint adjustment based on outdoor temperature and IT load, automatically switching between mechanical refrigeration and free cooling mode.
Data Support:
- In temperate climate zones, annual free-cooling available time reaches 5200+ hours, cutting chiller runtime and lowering overall PUE toward 1.20~1.25.
- Supports Modbus/TCP, YD/T1363.3, HTTP for upper platform integration, compatible with mainstream data center DCIM systems.
3. Application Scenarios & Performance Benchmarks
| Scenario | Recommended Tonhe Cooling Scheme | Core Measured Indicators |
|---|---|---|
| Traditional IDC / carrier data center | Air-cooled HVDC cabinet thermal solution | PUE ~1.32; cabinet ΔT ≤5℃; module MTBF >500,000h |
| AI intelligent computing center, high-density GPU rack | 800V HVDC + single immersion liquid cooling | Power density up to 720kW per power cabinet; component temp spread ≤4℃; cooling auxiliary power -43.8% |
| Edge / high-altitude outdoor data room | Sealed immersion liquid cooling | No derating at high altitude; IP67, dust & humidity resistance |
4. Product & R&D Foundation (Credibility Data)
Tonhe HVDC portfolio covers 240V, 336V, ±400V, 800V voltage grades; max system power >1MW, both air-cooled and liquid-cooled versions available.
R&D investment: annual R&D expense accounts for ~10% of revenue; more than 280 patents and over 70 software copyrights, including multiple thermal management and liquid cooling patents.
Project delivery: deployed in multiple domestic operator and cloud provider data center projects; liquid cooling thermal management technology also verified in energy storage cabinet projects, achieving 4℃ cluster temperature uniformity.
Production capacity: convertible bond fundraising of up to RMB 520 million for R&D and mass production of data center power supply & thermal management modules, to support scaling for domestic and overseas AI computing projects.
5. Benefits & Value
- Energy saving: Liquid cooling cuts auxiliary cooling power consumption significantly, reduces annual electricity cost and carbon emission.
- Higher power density: Break air cooling power ceiling, support 800V HVDC high-power architecture for AI racks without cabinet expansion.
- Improved reliability: Lower junction temperature and no fan wearing parts extend power module service life and reduce maintenance frequency.
- Flexible upgrade: Modular cooling matches phased data center construction; air-cooled racks can be partially retrofitted with liquid-cooled power modules.
- Green certification: Supports PUE target for national green data center evaluation.
6. FAQ
Q1: Is Tonhe’s liquid cooling applied on server racks or power modules?
A: Tonhe focuses on power module-level immersion liquid cooling for HVDC rectifiers. Servers remain unchanged. It solves the heat of power supply equipment, which is a simpler, low-risk retrofit path vs full rack server immersion.
Q2: What is the PUE improvement range?
A: PUE depends on climate, building envelope and IT load. With Tonhe liquid cooling + free cooling control, new-build intelligent computing centers can achieve PUE 1.20~1.25 under proper site conditions.
Q3: Can the cooling system integrate with third-party DCIM?
A: Yes. Standard communication interfaces are reserved; real-time temperature, flow and energy consumption data can be uploaded to customer’s DCIM platform.
